Ultra Universal Preheating Platform Mobile Phone Motherboard Layered Bonding Glue Removal Dot Matrix Repair Heater

Feature：

High Quality Material：Aluminium alloy work surface, will not be affected by rust, low temperature preheating saves energy. Imported infrared ceramic heating body, heating block, high efficiency and long service life

Preheating Rework Station：Can be used for preheating of circuit boards, as well as other processes that require overall uniform heating. Be available for tinning，delamination，lamination，degunmming

Wide Application：Anti-static design. Applicable to electronic equipment maintenance, mobile communication maintenance, and factory production, research and development preheating, drying work processing.

Specification：

Material：Aluminium alloy+Plastic

Temperature range: 20 to 260 ° C

Suitable for various sizes of mobile phone motherboards

Package include：

1x preheating platform

1x Power Adapter